Heat Transfer Management Apparatuses Having A Composite Lamina

ABSTRACT

Heat transfer management apparatuses are disclosed. In one embodiment, a heat transfer management apparatus includes a composite lamina having an insulator substrate and a plurality of thermal conductor traces coupled to the insulator substrate. The plurality of thermal conductor traces are arranged into a first enhanced thermal conduction region and a second enhanced thermal conduction region. The heat transfer management apparatus also includes a heat generating component mount and a temperature sensitive component mount in electrical continuity with the heat generating component mount, where a shielding path projection extends from the heat generating component mount towards the temperature sensitive component mount, and at least one of the thermal conductor traces is transverse to the shielding path projection between the heat generating component mount and the temperature sensitive component mount to steer heat flux away from the temperature sensitive component mount.

CROSS-REFERENCE TO RELATED APPLICATIONS

The instant application is related to U.S. application Ser. No.__/______ (Attorney Docket No. 22562-1026/2013-089-1), filed ______,2014, and titled “Heat Transfer Management Apparatus Having a CompositeLamina,” the entire disclosure of which is hereby incorporated byreference.

TECHNICAL FIELD

The present specification generally relates to heat transfer managementapparatuses and, more particularly, heat transfer management apparatuseshaving a composite lamina with thermal conductor traces that steer heatflux.

BACKGROUND

In general, electrical components generate heat as a byproduct of theoperation of the electrical components. However, an increase ingeneration of heat may be detrimental to performance and operation ofelectrical components. The heat generated by the operation of theelectrical components, therefore, is rejected into the surroundingenvironment. In some applications, heat-sensitive electrical componentsmay be located at positions in which heat from other electricalcomponents adversely affects operation of the heat-sensitive electricalcomponents.

Accordingly, heat transfer management apparatuses that affect the flowof thermal energy may be desired.

SUMMARY

In one embodiment, a heat transfer management apparatus includes acomposite lamina having an insulator substrate and a plurality ofthermal conductor traces coupled to the insulator substrate. Theplurality of thermal conductor traces are arranged into a first enhancedthermal conduction region and a second enhanced thermal conductionregion, where at least one of the plurality of thermal conductor tracesin the first enhanced thermal conduction region extends in a directionthat is transverse to at least one of the thermal conductor traces inthe second enhanced thermal conduction region. The heat transfermanagement apparatus also includes a heat generating component mount anda temperature sensitive component mount in electrical continuity withthe heat generating component mount and positioned distally from theheat generating component mount, where a shielding path projectionextends from the heat generating component mount towards the temperaturesensitive component mount, and at least one of the thermal conductortraces is transverse to the shielding path projection between the heatgenerating component mount and the temperature sensitive component mountto steer heat flux away from the temperature sensitive component mount.

In another embodiment, a heat transfer management apparatus includes acomposite lamina having an insulator substrate and a plurality ofthermal conductor traces coupled to the insulator substrate, where theplurality of thermal conductor traces are arranged into a first enhancedthermal conduction region and a second enhanced thermal conductionregion. The heat transfer management apparatus also includes a heatgenerating component mount coupled to the composite lamina, atemperature sensitive component mount coupled to the composite laminaand positioned distally from the heat generating component mount, and atargeted heat rejection region positioned distally from the heatgenerating component mount. The heat transfer management apparatusfurther includes a shielding path projection that is positionedproximate to the first enhanced thermal conduction region and extendsfrom the heat generating component mount towards the temperaturesensitive component mount, and a focusing path projection that ispositioned proximate to the second enhanced thermal conduction regionand extends from the heat generating component towards the targeted heatrejection region at positions spaced apart from the shielding pathprojections. The thermal conductor traces are arranged relative to theinsulator substrate to increase thermal conduction in a directiontransverse to the shielding path projections in the first enhancedthermal conduction region to increase thermal conduction in thedirection transverse to the shielding path projections, and the thermalconductor traces are arranged relative to the insulator substrate toincrease thermal conduction in a direction generally parallel to thefocusing path projections in the second enhanced thermal conductionregion to increase thermal conduction in the direction of the focusingpath projections.

In yet another embodiment, a heat transfer management apparatus includesa composite lamina comprising an insulator substrate and a plurality ofthermal conductor traces coupled to the insulator substrate, where theplurality of thermal conductor traces are arranged into a first enhancedthermal conduction region and a second enhanced thermal conductionregion, a heat generating component mount coupled to the compositelamina, a temperature sensitive component mount coupled to the compositelamina and positioned distally from the heat generating component mount,and a targeted heat rejection region positioned distally from the heatgenerating component mount. The heat transfer management apparatus alsoincludes a shielding path projection that is positioned proximate to thefirst enhanced thermal conduction region and extends from the heatgenerating component mount towards the temperature sensitive componentmount, and a focusing path projection is positioned proximate to thesecond enhanced thermal conduction region and extends from the heatgenerating component towards the targeted heat rejection region atpositions spaced apart from the shielding path projections. The thermalconductor traces are arranged relative to the insulator substrate toprovide an anisotropic thermal conduction along the composite lamina, inwhich the thermal conduction is increased in a direction transverse tothe shielding path projection and increased in a direction parallel tothe focusing path projection.

BRIEF DESCRIPTION OF THE DRAWINGS

The embodiments set forth in the drawings are illustrative and exemplaryin nature and not intended to limit the subject matter defined by theclaims. The following detailed description of the illustrativeembodiments can be understood when read in conjunction with thefollowing drawings, where like structure is indicated with likereference numerals and in which:

FIG. 1 schematically depicts a side perspective view of a heat transfermanagement apparatus having a composite lamina according to one or moreembodiments shown or described herein;

FIG. 2 schematically depicts a side perspective view of a compositelamina of a heat transfer management apparatus according to one or moreembodiments shown or described herein;

FIG. 3 schematically depicts an exploded side perspective view of a heattransfer management apparatus having a plurality of composite laminaeaccording to one or more embodiments shown or described herein;

FIG. 4 schematically depicts a side sectional view of the heat transfermanagement apparatus of FIG. 2 shown along line A-A;

FIG. 5 schematically depicts a side sectional view of the heat transfermanagement apparatus of FIG. 2 shown along line B-B;

FIG. 6 schematically depicts a side perspective view of a heat transfermanagement apparatus having a plurality of composite laminae accordingto one or more embodiments shown or described herein;

FIG. 7 schematically depicts a top view of a heat transfer managementapparatus having a plurality of composite laminae according to one ormore embodiments shown or described herein;

FIG. 8 schematically depicts a top view of a heat transfer managementapparatus having a plurality of composite laminae according to one ormore embodiments shown or described herein;

FIG. 9 schematically depicts a top view of a heat transfer managementapparatus having a plurality of composite laminae according to one ormore embodiments shown or described herein;

FIG. 10 schematically depicts a top view of a heat transfer managementapparatus having a plurality of composite laminae according to one ormore embodiments shown or described herein; and

FIG. 11 schematically depicts a top view of a heat transfer managementapparatus having a plurality of composite laminae according to one ormore embodiments shown or described herein.

DETAILED DESCRIPTION

Reference will now be made in detail to embodiments of heat transfermanagement apparatuses that include features that direct the flow ofheat along the heat transfer management apparatuses. The heat transfermanagement apparatuses include one or more composite lamina that eachhave an insulator substrate and a plurality of thermal conductor tracesthat are coupled to the insulator substrate. The thermal conductorsdirect the thermal energy along the composite lamina in a directionand/or at a rate that differs from the direction and/or rate of the heatflux along an isotropic insulator substrate. By providing compositelamina having thermal conductors and insulator substrates in anisotropicarrangements, thermal energy may be directed in a direction and/or at arate that improves operation of the electrical components coupled to thecomposite lamina. Various embodiments of the heat transfer managementapparatuses will be described in more detail herein.

Referring now to FIG. 1, one embodiment of a heat transfer managementapparatus 100 is depicted. In this embodiment, the heat transfermanagement apparatus includes a composite lamina 120, which may act asan attachment substrate to which a variety of electrical components areattached. The heat transfer management apparatus 100 also includes aheat generating component mount 130 and a temperature sensitivecomponent mount 132 that are both coupled to the composite lamina 120.The temperature sensitive component mount 132 is positioned distallyfrom the heat generating component mount 130. A heat generatingcomponent 230 may be mounted to the heat transfer management apparatus100 through attachment with the heat generating component mount 130.Similarly, a temperature sensitive component 232 may be mounted to theheat transfer management apparatus 100 through attachment with thetemperature sensitive component mount 132.

In the embodiment depicted in FIG. 1, the heat generating component 230may be an electronics device that produces heat as a byproduct of itsoperation. The heat generating component 230 may be a variety ofelectronic devices that include integrated circuits, for example,computer processing units, graphical processing units, chipsets, and thelike. In some embodiments, the heat generating component 230 may be asemiconductor device such as those utilized in power inverters, voltagerectifiers, voltage regulators, and the like. Exemplary semiconductordevices include, but are not limited to, power insulated-gate bi-polartransistors, metal-oxide field-effect transistors, and the like. Inoperation, the heat generating component 230 generally produces heat asa waste byproduct of the designed operative function of the heatgenerating component 230. The heat produced by the heat generatingcomponent 230 in the heat transfer management apparatus 100 is generallyundesired, as electrical components are conventionally susceptible totemperature malfunction or permanent failure if an over-temperaturecondition is realized. Nevertheless, the heat generating component 230will continue to operate throughout a wide temperature band.

Additionally, in the embodiment depicted in FIG. 1, the temperaturesensitive component 232 may be selected from a variety of a temperaturesensitive electronic devices including, for example planar coupler, aninductor/transformer, a high-Q resonator, a detector, a current sensingresistor, a crystal oscillator, an aligned optical component, or a humaninterface control button. Operation of the temperature sensitivecomponent 232 may be adversely affected by thermal energy that isgenerated by the heat generating component 230. Accordingly, to managethe temperature of temperature sensitive components 232 coupled to thecomposite lamina 120, the composite lamina 120 includes heat transfermanagement features that modify the direction and/or intensity of theheat flux that flows along the composite lamina 120.

In the embodiment depicted in FIG. 1, the composite lamina 120 includesan insulator substrate 140 and thermal conductor traces 142 that arecoupled to the insulator substrate 140. The thermal conductor traces 142may be selected from any of a variety of materials having high thermalconduction properties, including, for example, copper, silver, gold,graphite, graphene, or other carbon-based conductors. The thermalconductor traces 142 may have a thermal conductivity, k_(c), that isgreater than the thermal conductivity of the insulator substrate 140,k_(i). In some embodiments, k is at least an order of magnitude greaterthan k_(i). The insulator substrate 140 may be selected from any of avariety of materials having low electronic conductivity, including, forexample, plastics such as polypropylene, polyester, nylon, epoxy and thelike, which may be combined with carbon or glass reinforcement. In oneembodiment, the insulator substrate 140 may be made from FR-4, which isa glass-reinforced epoxy. The insulator substrate 140 has a thermalconductivity, k_(i), that is less than the thermal conductivity of thethermal conductor traces 142, k_(c). In some embodiments, the compositelamina 120 may be printed circuit boards that are fabricated accordingto conventional manufacturing techniques. In some embodiments, thethermal conductor traces 142 are at least partially embedded in theinsulator substrate 140.

In the depicted embodiment, the thermal conductor traces 142 aregenerally spaced apart from one another, so that the thermal conductortraces 142 are isolated from contact with one another by insulatorsubstrate 140. Because of the separation from one another by theinsulator substrate 140, the thermal conductor traces 142 may bethermally isolated from one another, such that heat flux is more likelyto be conducted along the length of the thermal conductor traces 142than in directions transverse to the length of the thermal conductortraces 142. Determination of whether the thermal conductor traces 142are thermally isolated from one another may be based on the thermalconductor traces 142 being electrically isolated from one another, suchthat the arrangement of thermal conductor traces 142 and insulatorsubstrate 140 prevents the thermal conductor traces 142 within each ofthe composite lamina 120 from being in electrical continuity with oneanother.

Still referring to FIG. 1, the arrangement of the heat generatingcomponent mount 130 and the temperature sensitive component mount 132are arranged relative to one another to define a plurality of shieldingpath projections 180 that extend from the heat generating componentmount 130 towards the temperature sensitive component mount 132. In theembodiment depicted in FIG. 1, a plurality of shielding path projections180 extend from the perimeter 131 of the heat generating component mount130 to the perimeter 133 of the temperature sensitive component mount132. In the embodiment depicted in FIG. 1, the shielding pathprojections 180 extend from the plurality of shielding path projections180 are representative of the general direction of the flow of heat fluxthrough an isotropic substrate between the heat generating componentmount 130 to the temperature sensitive component mount 132. The heattransfer management apparatus 100 may also include a plurality offocusing path projections 184 that extend away from the heat generatingcomponent mount 130. The heat generating component mount 130 and thetemperature sensitive component mount 132 may be positioned such thatthe focusing path projections 184 generally do not overlap the shieldingpath projections 180. In some embodiments of the heat transfermanagement apparatus 100, the thermal conductor traces 142 may bepositioned to be generally aligned with and parallel to the focusingpath projections 184. In some embodiments, portions of the thermalconductor traces 142 may be generally aligned with and parallel to thefocusing path projections 184 at positions spaced apart from theshielding path projections 180.

As depicted in FIG. 1, a plurality of thermal conductor traces 142 arepositioned transverse to the shielding path projections 180 that extendfrom the heat generating component mount 130 to the temperaturesensitive component mount 132. In some embodiments, the thermalconductor traces 142 are perpendicular to some or all of the shieldingpath projections 180 that extend from the heat generating componentmount 130 to the temperature sensitive component mount 132. The thermalconductor traces 142 positioned proximate to the shielding pathprojections 180 are arranged into a first enhanced thermal conductionregion 150. The thermal conductor traces 142 that are positioneddistally from the shielding path projections 180 are arranged into asecond enhanced thermal conduction region 152.

The thermal conductor traces 142 in this location modify the heat fluxfrom the heat generating component 230 to the temperature sensitivecomponent 232. Because the thermal conductor traces 142 have higherthermal conductivity than the insulator substrate 140, heat energygenerated by the heat generating component 230 that is coupled to theheat generating component mount 130 may tend to be directed along thethermal conductor traces 142 and transverse to the shielding pathprojections 180 between the heat generating component mount 130 to thetemperature sensitive component mount 132. By directing the heat fluxtransverse to the shielding path projections 180, the introduction ofheat from the heat generating component 230 into the temperaturesensitive component mount 132 (and therefore the temperature sensitivecomponent 232) may be minimized. Instead, heat generated by the heatgenerating component 230 is directed along the thermal conductor traces142 away from the shielding path projections 180 into the secondenhanced thermal conduction regions 152, where the heat flux may bedirected away from the temperature sensitive component mount 132.

Still referring to FIG. 1, a plurality of the thermal conductor traces142 may be arranged in a nested array configuration relative to oneanother, such that the plurality of thermal conductor traces 142 aregenerally concave around the temperature sensitive component mount 132.The plurality of thermal conductor traces 142 arranged into the nestedarray generally have path lengths evaluated within the first enhancedthermal conduction region 150 in which the thermal conductor traces 142positioned proximate to the temperature sensitive component mount 132are less than path lengths of the thermal conductor traces 142 that arepositioned distally from the temperature sensitive component mount 132.The orientation of the nested array of the thermal conductor traces 142may reduce heat flux across the thermal conductor traces 142. Instead,heat flux may be directed along the lengths of the thermal conductortraces 142, such that the heat flux can be steered away from thetemperature sensitive component mount 132 and towards an element of theheat transfer management apparatus that is targeted to heat rejection.

A subset of thermal conductor traces 142 within the laminate assembly110 may be placed into electrical continuity with the heat generatingcomponent mount 130 and/or the temperature sensitive component mount132. This subset of thermal conductor traces 142 may be identified aselectrical conductors 144. The electrical conductors 144 in electricalcontinuity with the heat generating component mount 130 and/or thetemperature sensitive component mount 132 may deliver power to theassociated heat generating component mount 130 and/or the temperaturesensitive component mount 132, and/or may deliver electrical signals tothe heat generating component mount 130 and/or the temperature sensitivecomponent mount 132. The electrical conductors 144 may convey bothelectricity and heat along their lengths.

The thermal conductor traces 142, including the electrical conductors144, may be positioned within the composite lamina 120 to steer thedirection of heat flux along the composite lamina 120. Without beingbound by theory, heat flux tends to “diffuse” in all directions from ahigh-temperature region towards a low temperature region. Throughplacement of the thermal conductor traces 142 in the insulator substrate140, heat flux can be preferentially directed along the thermalconductor traces 142, modifying the pattern of diffusion of heat. Bycontrolling the direction of heat flux along the laminate assembly 110,temperature increase of temperature sensitive components 232 mounted tothe laminate assembly 110 can be minimized, thereby enhancingperformance of the temperature sensitive components 232 by minimizingunwanted heat flux from being transferred to the temperature sensitivecomponents 232. Additionally, the thermal conductor traces 142 that areelectrically isolated from at least one of the heat generating componentmount 130 or the temperature sensitive component mount 132 may conductmore heat flux than the electrical conductor 144 that is in electricalcontinuity with the heat generating component mount 130 and thetemperature sensitive component mount 132.

Still referring to FIG. 1, the heat transfer management apparatus 100may include a targeted heat rejection region 170 of the composite lamina120. In the embodiment depicted in FIG. 1, targeted heat rejectionregion 170 is a free convection region of the composite lamina 120through which heat is rejected into the surrounding environment. Heatflux that is directed along the thermal conductor traces 142 may beconducted towards the targeted heat rejection region 170 and into thesurrounding environment, thereby decreasing the heat that remains in theheat transfer management apparatus 100. In some embodiments, thetargeted heat rejection region 170 may include a heat sink 172 that isadapted to reject the heat flux into the surrounding environment. Heatflux that flows along the thermal conductor traces 142 from the heatgenerating component mount 130 towards the heat sink 172 may beconducted at a rate greater than a conventional composite lamina, suchthat the portions of the thermal conductor traces 142 regions positionedgenerally between the heat generating component mount 130 and the heatsink 172 define a second enhanced thermal conduction region 152. Inthese regions, the conductive heat transfer evaluated from the heatgenerating component mount 130 to the heat sink 172 is greater than theconductive heat transfer flowing through insulator substrate 140 alongan equivalent direction.

Because heat flux may be directed along all of the thermal conductortraces 142, including the electrical conductors 144, the electricalconductors 144 may direct some heat flux from the heat generatingcomponent mount 130 to the temperature sensitive component mount 132.However, because of the arrangement of the plurality of thermalconductor traces 142 into the second enhanced thermal conduction region152 and the first enhanced thermal conduction region 150, the flow ofheat flux along the composite lamina 120 may be primarily directed alongthe insulator substrate 140 and the thermal conductor traces 142 thatare not the electrical conductors 144. Because the electrical conductors144 account for a minority of conductive heat flow along the compositelamina 120, the conductive heat flow along the composite lamina 120 maybe effectively steered by the arrangement of the electrical conductors144 along the insulator substrate 140 according to heat managementrequirements of a particular end-user application. In the embodimentdepicted in FIG. 1, the heat flux may be steered away from thetemperature sensitive component mount 132 so that heat flux introducedto the temperature sensitive component 232 coupled to the temperaturesensitive component mount 132 may be minimized.

Referring now to FIG. 2, heat transfer management apparatus 100 having alaminate assembly 110 that includes a plurality of composite laminae 120is depicted. The laminate assembly 110 is depicted with the compositelamina 120 in an exploded state in FIG. 3. Similar to the embodiment ofthe composite lamina 120 described above with reference to FIG. 1, theembodiment of the laminate assembly 110 of the embodiment depicted inFIG. 2 may include a plurality composite lamina 120 that each include aplurality of thermal conductor traces 142 that are coupled to aninsulator substrate 140 in an arrangement that steers heat fluxaccording to requirements of a particular end-user application. In theembodiment depicted in FIG. 2, the thermal conductor traces 142 arearranged relative to the insulator substrate 140 into first enhancedthermal conduction regions 150 between the heat generating componentmount 130 and the temperature sensitive component mount 132, and intoenhanced thermal conduction regions 152 at positions outside of thefirst enhanced thermal conduction regions 150. By modifying theconductive heat transfer across a plurality of composite laminae 120that form the laminate assembly 110, the heat transfer along the heattransfer management apparatus 100 may be targeted to provide a desiredtemperature profile along the plurality of composite laminae 120.

Referring now to FIG. 3, the composite laminae 120 of the laminateassembly 110 are depicted in an exploded state. Each of the compositelamina 120 may include a thermal conductor trace 142 that is coupled tothe insulator substrate 140. In the depicted embodiment, each of thecomposite laminae 120 of the laminate assembly 110 have thermalconductor traces 142 that are arranged relative to the insulatorsubstrate 140 into similar or identical patterns relative to the heatgenerating component mount 130 and the temperature sensitive componentmount 132. However, it should be understood that some embodiments oflaminate assemblies 110 may include thermal conductor traces 142 andinsulator substrate 140 that are arranged into different or dissimilarconfigurations across different composite laminae 120.

Referring collectively to FIGS. 2 and 3, the first enhanced thermalconduction region 150 may reduce heat flux from being directed in afirst direction from the heat generating component mount 130 towards thetemperature sensitive component mount 132. By increasing the heattransfer along the thermal conductor traces 142 as compared to theinsulator substrate 140, the direction of flow of heat flux can be atleast partially controlled such that the layout of the thermal conductortraces 142 and the insulator substrate 140 steer the heat flux along thethermal conductor traces 142. In certain layouts of the thermalconductor traces 142 and the insulator substrate 140, by steering theheat flux away from the temperature sensitive component mount 132,operation of the temperature sensitive component 232 may be enhanced.The thermal conductivity of the laminate assembly 110 evaluated in thefirst direction from the heat generating component mount 130 to thetemperature sensitive component mount 132 across the first enhancedthermal conduction region 150 may be less than the thermal conductivityof the insulator substrate 140.

Still referring to FIGS. 2 and 3, the embodiment of the laminateassembly 110 may include a plurality of composite laminae 120 that eachhave thermal conductor traces 142 and insulator substrate 140. In atleast one of the composite lamina 120, the thermal conductor traces 142and the insulator substrate 140 may be arranged into first enhancedthermal conduction regions 150 and enhanced thermal conduction regions152. As discussed hereinabove, the first enhanced thermal conductionregions 150 may preferentially steer heat flux away from the firstdirection between the heat generating component mount 130 and thetemperature sensitive component mount 132. The second enhanced thermalconduction regions 152 may increase heat flux along the laminateassembly 110 at positions outside of the first enhanced thermalconduction regions 150. In the embodiment depicted in FIGS. 2 and 3, thesecond enhanced thermal conduction region 152 may steer heat flux awayfrom the temperature sensitive component mount 132 to reduce thetemperature of the temperature sensitive component 232.

The plurality of composite laminae 120 may, through conduction of heatflux through the thermal conductor traces 142 and the insulatorsubstrate 140, modify the heat flux by preferentially directing heatflux through the thickness of the laminate assembly 110. Byincorporating multiple composite lamina 120, each having first enhancedthermal conduction regions 150 and enhanced thermal conduction regions152, into the laminate assembly 110, the effects of shielding andconcentrating heat flux between the heat generating component 230 andthe temperature sensitive component 232 may be enhanced as compared witha single composite lamina 120. Such laminate assemblies 110 maysimultaneously manage heat transfer through the plurality of compositelaminae 120. Accordingly, a laminate assembly 110 having a plurality ofcomposite laminae 120 may manage the conduction of heat flux withgreater control than a single composite lamina 120 having first enhancedthermal conduction regions 150 and enhanced thermal conduction regions152.

In some embodiments, the arrangement of thermal conductor traces 142 inthe insulator substrate 140 may be uniform across all of the compositelamina 120. In other embodiments, the thermal conductor traces 142 maybe selectively positioned across each of the composite lamina 120 forefficient usage of thermal conductor traces 142 in managing heat fluxbetween the heat generating component 230 and the temperature sensitivecomponent 232. For example, in some embodiments, fewer thermal conductortraces 142 may be positioned in a composite lamina 120 that ispositioned distally from the heat generating component 230 as comparedto a composite lamina 120 positioned proximate to the heat generatingcomponent 230. Such arrangements may account for the tendency for heatflux to diffuse through insulator substrate 140, thereby minimizing theeffect of some portions of the thermal conductor traces 142 positionedwithin composite lamina 120 that are positioned distally from the heatgenerating component 230.

In some embodiments, the thermal conductor traces 142 positioned alongdifferent composite lamina 120 may be electrically coupled to oneanother with vias 160 that extend through at least a partial thicknessof one of the composite lamina 120. The vias 160 may be made of amaterial that is a thermal conductor. In some embodiments, the vias 160may be made from the same material as the thermal conductor traces 142.In some embodiments, the vias 160 may have thermal conductivity that isapproximately equivalent as the thermal conductivity of the thermalconductor traces 142. In some embodiments, the vias 160 may conduct bothheat flux and electrical energy from one composite lamina 120 to anothercomposite lamina 120. In the embodiment depicted in FIG. 4, each of thecomposite lamina 120 a, 120 b, 120 c, 120 d include thermal conductortraces 142 that extend to positions proximate to the vias 160 such thatthe thermal conductor traces 142 along each of the plurality ofcomposite laminae 120 may be in thermal continuity with the vias 160,and therefore each of the thermal conductor traces 142 may be in thermalcontinuity with one another.

In the embodiment depicted in FIG. 4, a plurality of vias 160 extendthrough the plurality of composite laminae 120 a, 120 b, 120 c, 120 d.The vias 160 are positioned to intersect thermal conductor traces 142that are positioned along different composite lamina 120. For example,as depicted in FIG. 4, the vias 160 extend from the upper-most compositelamina 120 a, through the intermediate composite laminae 120 b, 120 c,and to the lower-most composite lamina 120 d. In the depictedembodiment, the vias 160 are positioned to contact the thermal conductortraces 142 that are positioned along different composite lamina 120, sothat the thermal conductor traces 142 positioned along differentcomposite lamina 120 are placed into thermal conductivity with oneanother.

In contrast to the embodiment depicted in FIG. 4, in the embodimentdepicted in FIG. 5, the vias 160 are in contact with the thermalconductor traces 142 of the upper-most composite lamina 120 a and thelower-most composite lamina 120 d. The vias 160 place the thermalconductor traces 142 of the upper-most composite lamina 120 a intothermal conductivity with the thermal conductor traces 142 of thelower-most composite lamina 120 d. Because the via 160 is an efficientconductor of heat flux, heat flux generated proximate to the upper-mostcomposite lamina 120 a (for example, at the heat generating component230) may be conducted along the via 160 from the upper-most compositelamina 120 a to the thermal conductor traces 142 of the lower-mostcomposite lamina 120 d. The heat flux, therefore, may be steered by thethermal conductor traces 142 that are positioned along composite lamina120 that are spaced apart from the heat generating component 230 of theheat transfer management apparatus 100.

By steering the heat flux with the thermal conductor traces 142 that arepositioned proximate to different composite lamina 120 than thecomposite lamina 120 to which the heat generating component 230 and thetemperature sensitive component 232 are coupled, the heat flux that isintroduced to the temperature sensitive component 232 from the heatgenerating component 230 may be minimized.

Referring again to FIGS. 2 and 3, the electrical conductors 144, whichare a subset of the thermal conductor traces 142, may be positioned incomposite lamina 120 in which electrical continuity between the heatgenerating component 230 and the temperature sensitive component 232 isneeded. In the embodiment depicted in FIG. 2, the electrical conductors144 are positioned in the upper-most composite lamina 120 a of thelaminate assembly 110. The remaining composite lamina 120 in thelaminate assembly 110 are free from electrical conductors 144. Otherembodiments of the laminate assembly 110 having electrical conductors144 positioned in other composite lamina 120 will be described in moredetail below. Embodiments of the laminate assembly 110 according to thepresent disclosure may incorporate thermal conductor traces 142 andelectrical conductors 144 into the composite lamina 120 with oneanother. By incorporating thermal conductor traces 142 that areelectrically isolated from the electrical conductors 144, the laminateassembly 110 simultaneously maintains electrical continuity betweenelectrical components coupled to the laminate assembly 110 (i.e., theheat generating component 230 and the temperature sensitive component232) while managing heat flux along the laminate assembly 110. Further,because the electrical conductors 144 conduct heat, the configuration ofthe thermal conductor traces 142 across each of the plurality ofcomposite laminae 120 may dominate the heat flux that is directedthrough the electrical conductors 144, so that the overall heat fluxalong the laminate assembly 110 satisfies design criterion.

Still referring to the embodiment depicted in FIGS. 2 and 3, the thermalconductor traces 142 that are electrically isolated from the heatgenerating component mount 130 and the temperature sensitive componentmount 132 are positioned such that effect of the heat flux directedalong the electrical conductors 144 is minimized as compared to the heatflux that is preferentially directed along the thermal conductor traces142. In the embodiment depicted in FIGS. 2 and 3, at intermediatepositions between the heat generating component mount 130 and thetemperature sensitive component mount 132, the thermal conductor traces142 are positioned closer to the temperature sensitive component mount132 than the electrical conductors 144, which are in electricalcontinuity with the temperature sensitive component mount 132. Bypositioning the thermal conductor traces 142 closer to the temperaturesensitive component mount 132, the effect of heat flux that diffusesfrom the electrical conductors 144 towards the temperature sensitivecomponent mount 132 may be minimized. Additionally, as depicted in theembodiment of FIGS. 2 and 3, at least one of the electrical conductors144 that is in electrical continuity with the heat generating componentmount 130 and/or the temperature sensitive component mount 132 may havea greater path length that the thermal conductor traces 142 that areelectrically isolated from the temperature sensitive component mount132. Similarly, the thicknesses of the thermal conductor traces 142 maybe greater than the thicknesses of the electrical conductors 144. Bymodifying the path length and/or the thicknesses of the electricalconductors 144 as compared to the thermal conductor traces 142, theresistance to thermal conduction of the electrical conductor 144 mayincrease as compared to the thermal conductor traces 142, such that lessheat flux may be directed along the electrical conductor 144 as comparedto the thermal conductor traces 142.

Referring to FIGS. 1-3, heat transfer management apparatuses 100according to the present disclosure may incorporate anisotropicarrangements of the thermal conductor traces 142 within the insulatorsubstrate 140 to effectively steer heat flux along the laminate assembly110 in a directional manner. For example, in the embodiments depicted inFIGS. 1-3, the arrangement of the thermal conductor traces 142 and theelectrical conductors 144 effectively steers the heat flux according toa particular design, here, to minimize heat flux introduced to thetemperature sensitive component mount 132 from the heat generatingcomponent mount 130. The directionality of the heat flux may be causedby the anisotropic arrangement of the thermal conductor traces 142 thatincrease the heat flux in one direction and decrease the heat flux in asecond direction.

In the embodiment depicted in FIGS. 1-3, the anisotropic arrangement maybe evaluated around the temperature sensitive component mount 132. Asexhibited in the depicted embodiment, the thermal conductor traces 142are arranged in an anisotropic arrangement around the temperaturesensitive component mount 132 and between the heat generating componentmount 130 and the temperature sensitive component mount 132. In theembodiment depicted in FIGS. 2 and 3, each of the composite lamina 120includes no circular or polar symmetry of the thermal conductor traces142 evaluated around the temperature sensitive component mount 132.Because each the composite lamina 120 of the laminate assembly 110 ofFIGS. 2 and 3 has a similar arrangement of thermal conductor traces 142,the laminate assembly 110 has no cylindrical or spherical symmetryevaluated around the temperature sensitive component mount 132.Accordingly, the anisotropic arrangement of the thermal conductor traces142 in the insulator substrate 140 maintains direction heat flux alongthe laminate assembly 110.

Embodiments of the composite lamina 120 having thermal conductor traces142 at least partially embedded in the insulator substrate 140 aregenerally described herein, with respect to the effects of the thermalconductor traces 142 and the insulator substrate 140 on steady-stateheat transfer along the heat transfer management apparatus 100. Itshould be understood, however, that the particular material used as thethermal conductor traces 142 and the dimensions of the thermal conductortraces 142 relative to the insulator substrate 140 may be modified toaccommodate the thermal capacitance of the heat transfer managementapparatus 100, thereby managing the transient thermal response of theheat transfer management apparatus 100.

Referring now to FIGS. 6-8, another embodiment of the heat transfermanagement apparatus 200 is depicted. In this embodiment, the heattransfer management apparatus 200 includes a plurality of compositelaminae 220 that are coupled together in a laminate assembly 210. Theplurality of composite laminae 220 include an insulator substrate 140and thermal conductor traces 142 that are arranged to steer heat fluxalong the composite laminae 220 and away from the temperature sensitivecomponent mount 132. The arrangement of the insulator substrate 140 andthe thermal conductor traces 142 may direct heat flux from the heatgenerating component 230 towards a targeted heat rejection region 170(shown in the depicted embodiment as including a heat sink 172), whileminimizing the direction of heat flux into the temperature sensitivecomponent 232.

Various composite laminae 220 a, 220 d of the laminate assembly 210 aredepicted in FIGS. 7 and 8, respectively. Referring to FIG. 7, oneembodiment of the composite lamina 220 a includes a heat generatingcomponent mount 130 and a temperature sensitive component mount 132 towhich a heat generating component 230 and a temperature sensitivecomponent mount 232, respectively, are coupled. The composite lamina 220a also includes a plurality of thermal conductor traces 142 that arecoupled to an insulator substrate 140. As depicted, the composite lamina220 a includes a plurality of thermal conductor traces 142 that extend aportion of a distance between the heat generating component mount 130and the temperature sensitive component mount 132. The plurality ofthermal conductor traces 142 are terminated at through-holes 146 thatextend through the remaining thickness of the insulator substrate 140.Vias 160, as discussed hereinabove, are positioned within thethrough-holes 146 and extend away from the composite lamina 220 a.

Referring now to FIG. 8, another of the composite lamina 220 d thatforms the laminate assembly 210 is depicted. In the depicted embodiment,the composite lamina 220 d includes a plurality of thermal conductortraces 142 that are coupled to the insulator substrate 140. Theplurality of thermal conductor traces 142 in the composite lamina 220 dare positioned transverse to the shielding path projections 180 betweenthe heat generating component mount 130 to the temperature sensitivecomponent mount 132 of the upper-most composite lamina 220 a (compareFIGS. 6-8). By incorporating the plurality of thermal conductor traces142 into a composite lamina 220 d that is spaced apart from the heatgenerating component mount 130 to the temperature sensitive componentmount 132 of the upper-most composite lamina 220 a, heat flux from theheat generating component 230 may be directed to flow along compositelamina 220 that are thermally isolated from the temperature sensitivecomponent 232, thereby minimizing the heat that is directed to thetemperature sensitive component 232. Instead of heat flux being freelyconducted along the upper-most composite lamina 220 a, heat flux isdirected along the vias 160 to composite lamina 220 that are positioneddistally from the temperature sensitive component 232. Further, incertain embodiments of the laminate assembly 210, the thermal conductortraces 142 of each of the composite lamina 220 are separated byinsulator substrate 140. In these embodiments, the insulator substrate140 breaks any thermal continuity of the thermal conductor traces 142across the thickness of the laminate assembly 210. Therefore, heat fluxmay be impeded from flowing between composite lamina 220 that form thelaminate assembly 210.

Referring now to FIG. 9, another embodiment of a heat transfermanagement apparatus 300 having a composite lamina 320 is depicted. Inthis embodiment, the heat transfer management apparatus 300 includes aheat generating component 230 coupled to a heat generating componentmount 130, a first temperature sensitive device 232 a coupled to a firsttemperature sensitive component mount 132 a, and a second temperaturesensitive device 232 b coupled to a second temperature sensitivecomponent mount 132 b. Similar to the embodiments described hereinabove,the heat generating component 230 produces heat during its operation.The heat produced by the heat generating component 230 is rejected intothe surrounding environment.

To minimize the amount of heat that is transferred to the first andsecond temperature sensitive component mounts 132 a, 132 b, a pluralityof thermal conductor traces 142 are coupled to the insulator substrate140. The plurality of thermal conductor traces 142 are arranged intofirst enhanced thermal conduction regions 150 between the heatgenerating component mount 130 and the first and second temperaturesensitive component mount 132 a, 132 b, and between the first and secondtemperature sensitive component mounts 132 a, 132 b themselves. Thethermal conductor traces 142 are positioned transverse to the shieldingpath projections 180 that extend between the heat generating componentmount 130 and the first and second temperature sensitive componentmounts 132 a, 132 b. Additionally, the composite lamina 320 includes aplurality of thermal conductor traces 142 that are positioned transverseto intermediate shielding path projections 182 that extend between thefirst and second temperature sensitive component mount 132 a, 132 b. Atpositions spaced apart from the shielding path projections 180 and theintermediate shielding path projections 182, the thermal conductortraces 142 are arranged into enhanced thermal conduction regions 152.The thermal conductor traces 142 may steer heat flux along the thermalconductor traces 142 and steer the heat flux in directions generallyaway from the temperature sensitive component mounts 132 and towardslocations where the heat flux may be rejected into the surroundingenvironment, for example towards heat sinks (not shown).

Referring now to FIG. 10, another embodiment of a heat transfermanagement apparatus 400 having a composite lamina 420 is depicted. Inthis embodiment, the heat transfer management apparatus 400 includes aheat generating component 230 coupled to a heat generating componentmount 130, a first temperature sensitive device 232 a coupled to a firsttemperature sensitive component mount 132 a, and a second temperaturesensitive device 232 b coupled to a second temperature sensitivecomponent mount 132 b.

To minimize the amount of heat that is transferred to the first andsecond temperature sensitive component mounts 132 a, 132 b, a pluralityof thermal conductor traces 142 are coupled to the insulator substrate140. The plurality of thermal conductor traces 142 are arranged intofirst enhanced thermal conduction regions 150 between the heatgenerating component mount 130 and the first and second temperaturesensitive component mount 132 a, 132 b, and between the first and secondtemperature sensitive component mounts 132 a, 132 b themselves. Similarto the embodiment depicted in FIG. 9, the embodiment of the heattransfer management apparatus 400 depicted in FIG. 10 includes aplurality of the thermal conductor traces 142 are positioned transverseto the shielding path projections 180 that extend between the heatgenerating component mount 130 and the first and second temperaturesensitive component mounts 132 a, 132 b. Additionally, the compositelamina 420 includes a plurality of thermal conductor traces 142 that arepositioned transverse to the intermediate shielding path projections 182that extend between the first and second temperature sensitive componentmount 132 a, 132 b. At positions spaced apart from the shielding pathprojections 180 and the intermediate shielding path projections 182, thethermal conductor traces 142 are arranged into enhanced thermalconduction regions 152. The thermal conductor traces 142 may steer heatflux along the thermal conductor traces 142 and steer the heat flux indirections generally away from the temperature sensitive componentmounts 132 and towards locations where the heat flux may be rejectedinto the surrounding environment, for example towards heat sinks (notshown).

Referring now to FIG. 11, another embodiment of a heat transfermanagement apparatus 500 having a composite lamina 520 is depicted. Inthis embodiment, the heat transfer management apparatus 500 includes twoheat generating components 230 a, 230 b that are coupled to thecomposite lamina 520 through respective heat generating component mounts130 a, 130 b and two temperature sensitive components 232 a, 232 b thatare coupled to the composite lamina 520 through respective temperaturesensitive component mounts 132 a, 132 b.

Similar to the embodiments described hereinabove, to minimize the amountof heat that is transferred to the first and second temperaturesensitive component mounts 132 a, 132 b, a plurality of thermalconductor traces 142 are coupled to the insulator substrate 140. Theplurality of thermal conductor traces 142 are arranged into firstenhanced thermal conduction regions 150 between the first and secondheat generating component mounts 130 a, 130 b and the first and secondtemperature sensitive component mount 132 a, 132 b. The embodiment ofthe heat transfer management apparatus 500 depicted in FIG. 12 includesa plurality of the thermal conductor traces 142 that are positionedtransverse to the shielding path projections 180 that extend between thefirst and second heat generating component mounts 130 a, 130 b and thefirst and second temperature sensitive component mounts 132 a, 132 b. Atpositions spaced apart from the shielding path projections 180, thethermal conductor traces 142 are arranged into enhanced thermalconduction regions 152. The thermal conductor traces 142 may steer heatflux along the thermal conductor traces 142 and steer the heat flux indirections generally away from the temperature sensitive componentmounts 132 and towards locations where the heat flux may be rejectedinto the surrounding environment, for example towards the periphery ofthe composite lamina 520.

In the embodiment depicted in FIG. 11, the portions of the thermalconductor traces 142 that are positioned between the heat generatingcomponent mounts 130 a, 130 b and the periphery (which may include theperimeter) of the composite lamina 520 may be positioned into enhancedheat transfer regions. In these locations, the thermal conductor traces142 are positioned such that adjacent thermal conductor traces 142diverge from one another evaluated at positions proximate to theperiphery of the composite lamina 520. By positioning the thermalconductor traces 142 along the insulator substrate 140 at configurationsthat diverge with increasing distance from the first and second heatgenerating component mounts 130 a, 130 b, a substantial portion of theheat flux generated by the first and second heat generating components230 a, 230 b (which are coupled to the first and second heat generatingcomponent mounts 130 a, 130 b) may be directed towards the periphery ofthe composite lamina 520 and away from the first and second temperaturesensitive component mounts 132 a, 132 b. Additionally, the thermalconductivity evaluated from the first and second heat generatingcomponent mounts 130 a, 130 b may be greater in directions correspondingto the enhanced heat transfer region as compared to the reduced heattransfer regions between the first and second heat generating componentmounts 130 a, 130 b and the first and second temperature sensitivecomponent mounts 132 a, 132 b. Accordingly, by enhancing the flow ofheat flux in the desired direction and away from the temperaturesensitive component mounts 132 a, 132 b, temperature increase in thetemperature sensitive component mounts 132 a, 132 b may be minimized.

It should be understood that certain elements of the various embodimentsdescribed hereinabove may be combined to provide a heat transfermanagement apparatus that satisfies the requirements of a particularend-user application. In particular embodiments, the heat transfermanagement apparatus may include one or more composite lamina having avariety of configurations of thermal conductor traces that are coupledto insulator substrates to provide a desired heat transfer profile alongthe heat transfer management apparatus. Heat transfer managementapparatuses having a plurality of composite laminae may include viasthat pass through the thickness of the composite lamina and placethermal conductor traces of different composite lamina into thermalconduction with one another.

It should now be understood that heat transfer management apparatusesaccording to the present disclosure include a composite laminae thatincludes an insulator substrate and a plurality of thermal conductortraces. The thermal conductor traces are arranged into a first enhancedthermal conduction region that reduces the heat flux in a direction froma heat generating component towards a temperature sensitive componentwhile increasing the heat flux in a direction transverse to thedirection from the heat generating component towards the temperaturesensitive component. The thermal conductor traces are also arranged intoa second enhanced thermal conduction region that increases the heat fluxin a direction from the heat generating component towards thetemperature sensitive component as compared to the transverse direction.Through selective positioning of the thermal conductor in the insulatorsubstrate, the heat flux can be effectively steered along the thermalconductor traces to minimize increased temperature surrounding thetemperature sensitive component.

While specific mention has been made herein to conductive heat transferproperties offered by the heat transfer management apparatuses describedherein, the discussion hereinabove has been directed to heat transfer atsteady-state operation. It should be understood that the parameters ofthe heat transfer management apparatuses may be modified to suitparticular end-user requirements, including management of transient heattransfer. Management of heat flux in a transient time frame may beaccommodated by modifying the materials used in heat transfer managementapparatus, for example, the thermal conductor traces, the insulatorsubstrate, the vias, the heat generating component mount, thetemperatures sensitive component mount, and the heat sink. Additionally,for management of heat flux in a transient time frame along any onecomposite lamina, the configuration of the thermal conductor tracesrelative to the insulator substrate may be modified, including modifyingthe cross-sectional area of the thermal conductor traces as well as therelative spacing between adjacent thermal conductor traces and the shapeof the thermal conductor traces. The listing of elements that may bemodified to accommodate certain transient heat transfer characteristicsshould be considered to be illustrative and non-limiting examples.

It is noted that the terms “substantially” and “about” may be utilizedherein to represent the inherent degree of uncertainty that may beattributed to any quantitative comparison, value, measurement, or otherrepresentation. These terms are also utilized herein to represent thedegree by which a quantitative representation may vary from a statedreference without resulting in a change in the basic function of thesubject matter at issue.

While particular embodiments have been illustrated and described herein,it should be understood that various other changes and modifications maybe made without departing from the spirit and scope of the claimedsubject matter. Moreover, although various aspects of the claimedsubject matter have been described herein, such aspects need not beutilized in combination. It is therefore intended that the appendedclaims cover all such changes and modifications that are within thescope of the claimed subject matter.

1. A heat transfer management apparatus comprising: a composite laminacomprising an insulator substrate and a plurality of thermal conductortraces coupled to the insulator substrate, where the plurality ofthermal conductor traces are arranged into a first enhanced thermalconduction region and a second enhanced thermal conduction region,wherein at least one of the plurality of thermal conductor traces in thefirst enhanced thermal conduction region extends in a direction that istransverse to at least one of the thermal conductor traces in the secondenhanced thermal conduction region; a heat generating component mount;and a temperature sensitive component mount in electrical continuitywith the heat generating component mount and positioned distally fromthe heat generating component mount, wherein: a shielding pathprojection extends from the heat generating component mount towards thetemperature sensitive component mount; and at least one of the thermalconductor traces is transverse to the shielding path projection betweenthe heat generating component mount and the temperature sensitivecomponent mount to steer heat flux away from the temperature sensitivecomponent mount.
 2. The heat transfer management apparatus of claim 1,wherein at least one of the thermal conductor traces that is transverseto the shielding path projection is electrically isolated from the heatgenerating component mount and the temperature sensitive componentmount.
 3. The heat transfer management apparatus of claim 1, wherein:the composite lamina comprises a plurality of shielding path projectionsthat extend from a portion of a perimeter of the heat generatingcomponent mount to a portion of a perimeter of the temperature sensitivecomponent mount; and at least one of the thermal conductor traces istransverse to the plurality of shielding path projections between theportion of the perimeter of the heat generating component mount and theportion of the perimeter of the temperature sensitive component mount.4. The heat transfer management apparatus of claim 3, wherein at leastone of the thermal conductor traces is perpendicular to the plurality ofshielding path projections between the portion of the perimeter of theheat generating component mount and the portion of the perimeter of thetemperature sensitive component mount.
 5. The heat transfer managementapparatus of claim 1, further comprising a second temperature sensitivecomponent mount coupled to the composite lamina, wherein a secondshielding path projection extends from the heat generating componentmount towards the second temperature sensitive component mount, and atleast one of the plurality of thermal conductor traces is transverse tothe second shielding path projection.
 6. The heat transfer managementapparatus of claim 5, wherein an intermediate shielding path projectionextends from the temperature sensitive component mount towards thesecond temperature sensitive component mount, and one of the pluralityof thermal conductor traces is transverse to the intermediate shieldingpath projection.
 7. The heat transfer management apparatus of claim 6,wherein at least one of the plurality of thermal conductor traces istransverse to the intermediate shielding path projection and at leastone of the shielding path projection or the second shielding pathprojection.
 8. The heat transfer management apparatus of claim 1,further comprising a targeted heat rejection region, wherein at leastone of the plurality of thermal conductor traces that is transverse tothe shielding path projection is in thermal continuity with the targetedheat rejection region.
 9. The heat transfer management apparatus ofclaim 8, wherein at least one of the plurality of thermal conductortraces is generally parallel to a focusing path projection that extendsfrom the heat generating component towards the targeted heat rejectionregion at positions spaced apart from the shielding path projections.10. The heat transfer management apparatus of claim 8, wherein thetargeted heat rejection region comprises a heat sink.
 11. The heattransfer management apparatus of claim 1, wherein at least one of theplurality of thermal conductor traces is in electrical continuity withthe heat generating component mount and the temperature sensitivecomponent mount.
 12. The heat transfer management apparatus of claim 1,wherein at least two of the plurality of thermal conductor tracesdiverge from one another with increasing distance from the heatgenerating component mount.
 13. The heat transfer management apparatusof claim 1, wherein the heat generating component mount and thetemperature sensitive component mount are both coupled to the compositelamina.
 14. The heat transfer management apparatus of claim 1, furthercomprising: a plurality of composite laminae, each of the compositelaminae comprising an insulator substrate and a plurality of thermalconductor traces coupled to the insulator substrate; and a via extendingthrough a plurality of the composite laminae, the vias places thethermal conductor traces of different composite lamina into thermalcontinuity with one another.
 15. The heat transfer management apparatusof claim 14, further comprising: a heat generating component coupled tothe heat generating component mount of one of the composite lamina; anda temperature sensitive component coupled to the temperature sensitivecomponent mount of one of the composite lamina.
 16. The heat transfermanagement apparatus of claim 15, wherein the heat generating componentmount and the temperature sensitive component mount are coupled todifferent composite laminae.
 17. A heat transfer management apparatuscomprising: a composite lamina comprising an insulator substrate and aplurality of thermal conductor traces coupled to the insulatorsubstrate, where the plurality of thermal conductor traces are arrangedinto a first enhanced thermal conduction region and a second enhancedthermal conduction region; a heat generating component mount coupled tothe composite lamina; a temperature sensitive component mount coupled tothe composite lamina and positioned distally from the heat generatingcomponent mount; and a targeted heat rejection region positioneddistally from the heat generating component mount, wherein: a shieldingpath projection is positioned proximate to the first enhanced thermalconduction region and extends from the heat generating component mounttowards the temperature sensitive component mount; a focusing pathprojection is positioned proximate to the second enhanced thermalconduction region and extends from the heat generating component towardsthe targeted heat rejection region at positions spaced apart from theshielding path projections; the thermal conductor traces are arrangedrelative to the insulator substrate to increase thermal conduction in adirection transverse to the shielding path projections in the firstenhanced thermal conduction region to increase thermal conduction in thedirection transverse to the shielding path projections; and the thermalconductor traces are arranged relative to the insulator substrate toincrease thermal conduction in a direction generally parallel to thefocusing path projections in the second enhanced thermal conductionregion to increase thermal conduction in the direction of the focusingpath projections.
 18. The heat transfer management apparatus of claim17, wherein the thermal conductor traces extend in a directiontransverse to the shielding path projections in the first enhancedthermal conduction region.
 19. The heat transfer management apparatus ofclaim 17, wherein the thermal conductor traces extend in a directionthat is generally parallel to the focusing path projections.
 20. A heattransfer management apparatus comprising: a composite lamina comprisingan insulator substrate and a plurality of thermal conductor tracescoupled to the insulator substrate, where the plurality of thermalconductor traces are arranged into a first enhanced thermal conductionregion and a second enhanced thermal conduction region; a heatgenerating component mount coupled to the composite lamina; atemperature sensitive component mount coupled to the composite laminaand positioned distally from the heat generating component mount; and atargeted heat rejection region positioned distally from the heatgenerating component mount, wherein: a shielding path projection ispositioned proximate to the first enhanced thermal conduction region andextends from the heat generating component mount towards the temperaturesensitive component mount; a focusing path projection is positionedproximate to the second enhanced thermal conduction region and extendsfrom the heat generating component towards the targeted heat rejectionregion at positions spaced apart from the shielding path projections;the thermal conductor traces are arranged relative to the insulatorsubstrate to provide an anisotropic thermal conduction along thecomposite lamina, in which the thermal conduction is increased in adirection transverse to the shielding path projection and increased in adirection parallel to the focusing path projection.